REPTALICA

MEDIATEK

Helio G99

Upper mid-range AP released in 2022, TSMC N6. Popular in budget-to-mid gaming phones, widely adopted by Xiaomi, Redmi, and Realme.

MEDIATEK

Dimensity 7300

Midranger AP released in 2022, manufactured with TSMC N4 process.

MEDIATEK

Dimensity 8000

AP released in 2022, TSMC N5. Binned down version of Dimensity 8100.

MEDIATEK

Dimensity 8100

AP released in 2022, TSMC N5. Used in sub-flagship phones.

MEDIATEK

Dimensity 8200

AP released in 2022, TSMC N4. D8100 ported to N4 with clock speed bump.

MEDIATEK

Dimensity 700

Budget 5G SoC released in 2021, TSMC N7. Used in various budget 5G smartphones.

SAMSUNG

Exynos 1080

Mid-range AP released in 2020, Samsung 5nm.

SAMSUNG

Exynos 1480

AP released in 2024, Samsung SF4. Used in higher end A/M/F series phones.

SAMSUNG

Exynos 1580

AP released in 2025, Samsung SF4P. Used in higher end A/M/F series phones.

SAMSUNG

Exynos 2100

Flagship AP released in 2021, Samsung 5nm. Used in Galaxy S21 series.

SAMSUNG

Exynos 2300

Unreleased AP, Samsung SF4P. Planned for S23 series, scrapped due to yield issues.

SAMSUNG

Exynos 990

AP released in 2020, Samsung 8nm. Used in Galaxy S20 series.

SAMSUNG

Exynos Auto V920

Canceled automotive processor due to no sales. RDNA 2 4WGP GPU.

SAMSUNG

Exynos 2600

AP released in 2026 with a RDNA 4 based GPU, Samsung SF2. Used in Galaxy S26 series.

NVIDIA

Jetson AGX Orin

High-performance edge AI SoC released in 2022, Samsung 8nm. 12-core Arm Cortex-A78AE + 2048-core Ampere GPU, delivering up to 275 TOPS.

NVIDIA

Drive AGX Thor

Automotive SoC released in 2025, TSMC 4N. Used in Xiaomi YU7 series.

NVIDIA

GB202

GPU released in 2024, TSMC 4N. Used in RTX 5090, RTX PRO 6000, RTX PRO 5000...

GOOGLE

Tensor

Google's first custom SoC, 2021, Samsung 5nm. Used in Pixel 6 series.

GOOGLE

Tensor G2

SoC released in 2022, Samsung 5nm. Used in Pixel 7 series.

GOOGLE

Tensor G3

SoC released in 2023, Samsung SF4P. Used in Pixel 8 series.

GOOGLE

Tensor G5

SoC released in 2025, TSMC N3P. Used in Pixel 10, Pixel 10 Pro, Pixel 10 Pro XL, Pixel 10 Pro Fold.

QUALCOMM

Ride SA8650P

Automotive processor with 2x Hexagon DSP delivering 100 Dense TOPS.

QUALCOMM

Snapdragon 855

Flagship AP released in 2018, TSMC N7.

QUALCOMM

Snapdragon X Elite

High-performance ARM PC processor, 2024, TSMC N4. Oryon custom cores for Windows on ARM laptops.

QUALCOMM

Snapdragon 778G

Upper mid-range AP, 2021, TSMC N5. Featured in Galaxy A52s 5G, Mi 11 Lite 5G NE, and others.

QUALCOMM

Snapdragon 780G

Upper mid-range AP, 2021, SF5E, mini 888 or sort.

QUALCOMM

Snapdragon 7+ Gen 3 / 8s Gen 3

Shared die between two SKUs, 2024, TSMC N4P. Same silicon, different clocks and branding for mid vs sub-flagship tiers.

QUALCOMM

Snapdragon 8 Elite

Flagship AP, 2024, TSMC N3E. First Qualcomm chip with Oryon custom cores.

QUALCOMM

Snapdragon 7 Gen 3

Mid-range AP released in 2023, TSMC N4.

QUALCOMM

Snapdragon W5(+) Gen 1/2/3

Wearable SoC released in 2022, 4nm process. And again in 2025. And again in the near future.

QUALCOMM

Snapdragon 4 Gen 2/4

Qualcomm Recycling Masterclass™. Samsung 4LPX.

INTEL

Lakefield Compute Tile

Hybrid CPU tech, 2020, Intel 10nm + 22nm base die. Featured in Surface Neo and Galaxy Book S.

INTEL

i7-7660U

"Waiter, can I have more GPU?" Kaby Lake mobile, 2017, Intel 14nm+. Iris Plus 640 with 64MB eDRAM.

INTEL

Coffee Lake Octa-core

Released 2018, Intel 14nm++. 8-core die featured in i7/i9 8th Gen.

INTEL

Cannon Lake

Intel's cursed 10nm debut, 2018. Only one SKU shipped (i3-8121U) before being quietly cancelled due to yield disasters.

INTEL

DG2-128 (Arc A380)

Entry-level discrete GPU, 2022, TSMC N6. 128 EU Xe-HPG architecture, Intel's return to discrete graphics.

INTEL

Arrow Lake S (Core Ultra 200S)

Desktop CPU released in 2024, Intel 20A + TSMC N5/N6 tiles. Hybrid P/E/LP-E core design, first Intel desktop chip built on a multi-tile package.

ALLWINNER

Allwinner A527

Just manufactured e-waste (jk).

LOONGSON

Loongson 3A6000

Quad-core desktop processor released in 2023, 12nm. Based on LoongArch (LA664).

XIAOMI

XRing O1

SoC released in 2025, TSMC N3E. Used in Xiaomi 15S Pro, Pad 7 Ultra, Pad 7S Pro.

XIAOMI

Pinecone Surge S1

Mid-range SoC, 2017, TSMC 28nm HPC+. Xiaomi's first in-house chipset, featured in Mi 5c.

HUAWEI

Kirin 980

Flagship AP, 2018, TSMC N7. Used in Mate 20 series, P30 series, Honor 20 series...

HUAWEI

Kirin 9000

Flagship AP, 2020, TSMC N5. Used in Mate 40 Pro. Last Kirin on advanced TSMC nodes before sanctions.

HUAWEI

Kirin 9000 ES (Cortex-X1)

What could have been. A55 + A78 + X1 on TSMC N5, truly an ideal SD888, but sanctions prevented completion.

UNISOC

Unisoc T820 / T9100

Mid-range 5G SoC, 2022, TSMC N6. Featured in ZTE shitters and some handheld android consoles.

AMD

Ryzen 5 7250U

Mendocino mobile APU, TSMC N6. Features 4 Zen 2 cores and RDNA 2 graphics.

AMD

PS5 APU / AMD 4700S "Oberon"

Semi-custom SoC, 2020, TSMC N7. 8 Zen 2 cores + RDNA 2. Defective dies sold as AMD 4700S Desktop Kit.

AMD

PS4 APU / AMD "Liverpool"

Semi-custom SoC, 2013, TSMC 28nm. 8 Jaguar cores + GCN graphics.

AMD

Xbox Series X SoC

Semi-custom AMD SoC, 2020, TSMC N7. 8 Zen 2 cores + 52 CU RDNA 2 GPU for 12 TFLOPS.

AMD

Xbox Series S SoC

Semi-custom AMD SoC, 2020, TSMC N7. Cut-down variant with 8 Zen 2 cores + 20 CU RDNA 2 GPU for 4 TFLOPS.

APPLE

Apple A4

Apple's first in-house SoC, 2010, Samsung 45nm. Single Cortex-A8 core, powered the original iPad and iPhone 4.

APPLE

Apple A5 (APL7498)

Special variant for Apple TV 3rd Gen. 32nm node, 1 CPU core and 2 GPU EUs removed vs original A5.

APPLE

Apple A5

Dual-core SoC released in 2011, Samsung 45nm. Powered iPhone 4S, iPad 2, and iPod touch 5th gen.

APPLE

Apple A6

Apple's first custom-designed CPU core (Swift). Released in 2012, Samsung 32nm. Powered iPhone 5.

APPLE

Apple A7

First 64-bit mobile SoC, 2013, Samsung 28nm. Dual-core Cyclone CPU, powered iPhone 5s with Touch ID.

APPLE

Apple A8

SoC released in 2014, TSMC 20nm. Dual-core Typhoon CPU, powered iPhone 6 and iPad mini 4.

APPLE

Apple A9 (Samsung)

Samsung 14nm variant of the A9. Dual-sourced with TSMC for iPhone 6s, notable for "chipgate" battery life controversy.

APPLE

Apple A9 (TSMC)

TSMC 16nm variant of the A9. Dual-sourced with Samsung for iPhone 6s, slightly better battery life in "chipgate" tests.

APPLE

Apple A10 Fusion

First quad-core Apple SoC famous for being a big or LITTLE SoC, 2016, TSMC 16nm. Powered iPhone 7 and iPad 6th/7th gen.

APPLE

Apple A11 Bionic

Apple's first SoC with a Neural Engine, released in 2017, TSMC 10nm. Powered iPhone 8 and the iconic iPhone X.

APPLE

Apple A12 Bionic

The industry's first mass-market 7nm SoC, 2018, TSMC N7. Powered iPhone XS, XR, and iPad Air 3rd Gen.

APPLE

Apple A12X / A12Z Bionic

High-performance tablet SoC, 2018/2020, TSMC N7. 8-core CPU + 7/8-core GPU. Powered iPad Pro 3rd/4th Gen and brief Mac transition via DTK.

APPLE

Apple A13 Bionic

Flagship SoC released in 2019, TSMC N7P. Powered iPhone 11 series and the 2nd generation iPhone SE.

APPLE

Apple A14 Bionic

The first commercially available 5nm chip, 2020, TSMC N5. Powered the iPhone 12 series and iPad Air 4th Gen.

APPLE

Apple A15 Bionic

Released in 2021, TSMC N5P. Featured in iPhone 13/14 series and iPad mini 6th Gen with specialized GPU variants.

APPLE

Apple A16 Bionic

Flagship SoC released in 2022, TSMC N4P. Powering the iPhone 14 Pro and iPhone 15 series.

APPLE

Apple A17 Pro

Flagship SoC released in 2023, TSMC N3B. First 3nm mobile chip, hardware ray tracing GPU. Powered iPhone 15 Pro series.

APPLE

Apple A18 Pro

Flagship SoC released in 2024, TSMC N3E. Enhanced Neural Engine for Apple Intelligence. Powered iPhone 16 Pro series.

APPLE

Apple A19 Pro

Flagship SoC released in 2025, TSMC N3P. The best. Undisputed (just ignore the GPU pls).

APPLE

Apple S9

SiP released in 2023, TSMC N4. Powers Apple Watch Series 9 and Ultra 2 with 4-core Neural Engine.

APPLE

Apple M2

Second-gen Apple Silicon, 2022, TSMC N5P. 8-core CPU + 10-core GPU, powered MacBook Air/Pro 13" and iPad Pro.

APPLE

Apple M2 Pro

Pro-tier Apple Silicon, 2023, TSMC N5P. Up to 12-core CPU + 19-core GPU, powered MacBook Pro 14"/16" and Mac mini.

MOORE THREADS

Moore Threads SD102

Chinese domestic GPU released in 2024. Musa architecture targeting desktop and workstation markets — part of China's push for GPU independence.

PHYTIUM

Tengrui D3000

Chinese server-grade processor based on ARM architecture. Designed for domestic cloud and HPC workloads, exempt from US export controls at time of release.

SPACEMIT

SpacemiT K1

RISC-V SoC released in 2024, 12nm. 8-core X60 (RV64GCVB), the first mass-market chip with RVV 1.0 vector extension. Powers the Banana Pi BPI-F3 and Bianbu Pad.

TESLA

Tesla HW3

FSD computer for autonomous driving, Samsung 14nm.