Dimensity 7300
Midranger AP released in 2022, manufactured with TSMC N4 process.
STATUS : annotated dieshots & silicon photography
Midranger AP released in 2022, manufactured with TSMC N4 process.
AP released in 2022, TSMC N5. Binned down version of Dimensity 8100.
AP released in 2022, TSMC N5. Used in sub-flagship phones.
AP released in 2022, TSMC N4. D8100 ported to N4 with clock speed bump.
AP released in 2024, Samsung SF4. Used in higher end A/M/F series phones.
AP released in 2025, Samsung SF4P. Used in higher end A/M/F series phones.
Unreleased AP, Samsung SF4P. Planned for S23 series, scrapped due to yield issues.
AP released in 2020, Samsung 8nm. Used in Galaxy S20 series.
Automotive SoC released in 2025, TSMC 4N. Used in Xiaomi YU7 series.
GPU released in 2024, TSMC 4N. Used in RTX 5090, RTX PRO 6000, RTX PRO 5000...
SoC released in 2023, Samsung SF4P. Used in Pixel 8 series.
SoC released in 2025, TSMC N3P. Used in Pixel 10, Pixel 10 Pro, Pixel 10 Pro XL, Pixel 10 Pro Fold.
Flagship AP released in 2018, TSMC N7.
High-performance ARM PC processor, 2024, TSMC N4. Oryon custom cores for Windows on ARM laptops.
Hybrid CPU tech, 2020, Intel 10nm + 22nm base die. Featured in Surface Neo and Galaxy Book S.
"Waiter, can I have more GPU?" Kaby Lake mobile, 2017, Intel 14nm+. Iris Plus 640 with 64MB eDRAM.
Released 2018, Intel 14nm++. 8-core die featured in i7/i9 8th Gen.
Just manufactured e-waste (jk).
SoC released in 2025, TSMC N3E. Used in Xiaomi 15S Pro, Pad 7 Ultra, Pad 7S Pro.
Mid-range SoC, 2017, TSMC 28nm HPC+. Xiaomi's first in-house chipset, featured in Mi 5c.
Flagship AP, 2018, TSMC N7. Used in Mate 20 series, P30 series, Honor 20 series...
Flagship AP, 2020, TSMC N5. Used in Mate 40 Pro. Last Kirin on advanced TSMC nodes before sanctions.
What could have been. A55 + A78 + X1 on TSMC N5, truly an ideal SD888, but sanctions prevented completion.
Mid-range 5G SoC, 2022, TSMC N6. Featured in ZTE shitters and some handheld android consoles.
Mendocino mobile APU, TSMC N6. Features 4 Zen 2 cores and RDNA 2 graphics.
Semi-custom SoC, 2020, TSMC N7. 8 Zen 2 cores + RDNA 2. Defective dies sold as AMD 4700S Desktop Kit.
Semi-custom SoC, 2013, TSMC 28nm. 8 Jaguar cores + GCN graphics.
Apple's first in-house SoC, 2010, Samsung 45nm. Single Cortex-A8 core, powered the original iPad and iPhone 4.
Special variant for Apple TV 3rd Gen. 32nm node, 1 CPU core and 2 GPU EUs removed vs original A5.
Dual-core SoC released in 2011, Samsung 45nm. Powered iPhone 4S, iPad 2, and iPod touch 5th gen.
Apple's first custom-designed CPU core (Swift). Released in 2012, Samsung 32nm. Powered iPhone 5.
First 64-bit mobile SoC, 2013, Samsung 28nm. Dual-core Cyclone CPU, powered iPhone 5s with Touch ID.
SoC released in 2014, TSMC 20nm. Dual-core Typhoon CPU, powered iPhone 6 and iPad mini 4.
Samsung 14nm variant of the A9. Dual-sourced with TSMC for iPhone 6s, notable for "chipgate" battery life controversy.
TSMC 16nm variant of the A9. Dual-sourced with Samsung for iPhone 6s, slightly better battery life in "chipgate" tests.
First quad-core Apple SoC famous for being a big or LITTLE SoC, 2016, TSMC 16nm. Powered iPhone 7 and iPad 6th/7th gen.
Apple's first SoC with a Neural Engine, released in 2017, TSMC 10nm. Powered iPhone 8 and the iconic iPhone X.
The industry's first mass-market 7nm SoC, 2018, TSMC N7. Powered iPhone XS, XR, and iPad Air 3rd Gen.
Flagship SoC released in 2019, TSMC N7P. Powered iPhone 11 series and the 2nd generation iPhone SE.
The first commercially available 5nm chip, 2020, TSMC N5. Powered the iPhone 12 series and iPad Air 4th Gen.
Released in 2021, TSMC N5P. Featured in iPhone 13/14 series and iPad mini 6th Gen with specialized GPU variants.
Flagship SoC released in 2022, TSMC N4P. Powering the iPhone 14 Pro and iPhone 15 series.
Flagship SoC released in 2025, TSMC N3P. The best. Undisputed (just ignore the GPU pls).
SiP released in 2023, TSMC N4. Powers Apple Watch Series 9 and Ultra 2 with 4-core Neural Engine.